SMD resistor welding - how to go Knowledge of electrical resistance

by:Thermistor-Mov     2020-06-21
SMD resistor SMD resistor is mainly introduced in this paper how to welding is how to weld, in this paper, probably about 1290 words, read the full article 13 minutes. 1, the first in the required welding welding plate coated with a layer of rosin water. Note that the coated parts only a thin layer of rosin water, not too much profit, otherwise it will leave flux residues, affect the cleanliness, refuses to pass. When excessive flux residues can dip in with cotton swabs take alcohol to wipe clean, apply again. 2, preheating first, then on the tin. Soldering iron and welding surface should be tilted 45 degrees. Contact pressure, welding head should be slightly when in contact with by welding pressure, heat transfer intensity is proportional to the pressure on the size, but to be no damage on the surface of the welding for the principle. Note: the time between the heating pad and solder wire supply control within 1 s, the heating time not too long, lest cause bonding pad case become warped, damage the pad. 3, add solder. In principle be welding temperature reaches the melting temperature of solder is immediately to solder wire. Note: the solder wire supply and heating time control within 1 s between solder wire, heating time not too long, so as not to damage the pad. Action should be quick and coherent. Such as the heating time is too long, easily aging or formation on the surface of solder tin slag, soldering easy icicles, solder joint without burnish. Such as the heating time is too short, affect the solder wetting, surface is not smooth, have a bubble, pinhole, or cold welding. 4, to solder. When a good contact with solder and solder, smoke to solder wire, rapid action should be coherent. 5, to iron. Action should be coherent quickly to a solder joint are suitable for 1 s, the time is too long easily aging or formation on the surface of solder tin slag, soldering easy icicles, solder joint without burnish. Note: the amount of tin welding plate, not too much, in the case of patch welding not skilled, the solder joint can be regarded as a fixed role. As a result, the amount of tin solder not too much, welding time is too long. Also should avoid and neighboring solder bridge. 6, application of flat non-slip tweezers or anti-static tweezers clip SMD resistor. Clamp with forceps is welded components the middle part of the components on the solder side, adjust the welding position, adjust the welding direction of SMD resistor, the nominal value read direction with screen printing label in the same direction. Use tweezers clamp element when appropriate, not too hard, prevent damage of components or splash. Into the next phase of the operation of the process. 7, the molten solder. Solder melting, at the same time for the next working procedure. Heating the solder melting time not too long, otherwise it will cause solder aging or tin slag formation, soldering easy icicles, solder joint without burnish. Such as the heating time is too short, affect the solder wetting, surface is not smooth, have a bubble, pinhole, or cold welding. 8, quickly inserted the components close to welding plate edge and the good welding. Element into the solder welding plate must be close to the surface of the motherboard to insert, and make the middle of the element in the entire installation position. 9, when the components and complete welding plate between the solder wetting, smoke to soldering iron. If welding end find tin solder aging or burr, too much too little, can not change, such as modified together again on the other side of the welding is completed. 10 other side solder joints, welding components, reference 2 - operation steps and matters needing attention 5. 11, refer to the IPC standard check solder joints. If welding completed after arrival tilt and the phenomenon of high and low, pay attention to cannot use tweezers to resist components surface, press the resistor, with a soldering iron stick it out when the molten solder the components such operation, easy to make devices under non-uniform fracture under external force. The correct operation is first melt solder again to adjust the clamp element in the middle with forceps. 12, refer to the IPC standard check solder joints, such as defective need to repair or replacement. Remove the element method: in adding tin solder joints on both ends, to make both ends solder solder in the molten state, at the same time for the next working procedure. Note: tin content cannot too much, prevent into the other bonding pad, keep the molten state. 13, under the solder molten state, use tweezers clip components and remove the required to replace the components. 14, with suction vacuum soldering tin belt. Take suction tin on the solder joints, then suction tin with electric heating, automatic flow to the suction when melt soldering tin belt, remove the solder. 15, with suction tin belt will clean up the solder. Note: just put the soldering clean, the heating time not too long, or it might damage the PCB pad. 16, remove soldering, cleaning after welding plate, a new welding operation. Link: http://www. xcy99。 com/Article/tpdzzyqhj_1。 HTML this paper label: a resistor SMD resistor: SMD tantalum capacitors under the application of an article: resistor commonly used materials and main performance
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